DIP / DIL = Dual In Line Package.  Mostly through hole type package used to put on one side of the PCB ( Printed Circuit Board ) and solder on the opposite side of the PCB.

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SIL / SIP = Single In Line Package.

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PDIP = Plastic Dual In Line Package.

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CDIP = Ceramic Dual In Line Package.

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SO / SOIC  / SOP : Small-Outline Integrated Circuit

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QIP / QIL = Quadraple In Line Package.

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SMT = Surface Mount Technology package.  The IC is placed on the PCB and solder on the track of same side of the PCB. SOJ , SOIC , LQFP, QFN, MLF, QFP, MQFP are some variants of SMT ICs, having various types pin outs.

 

LQFP = Low-profile Quad Flat-Package is SMT IC.

 

TQFP = Thin Quad Flat-Package (having leads) is SMT IC.

 

TQFN = Thin Quad Flat No-lead

 

PLCC = Plastic Leaded Chip-Carrier

 

CLCC = Ceramic Leadless Chip-Carrier

 

QFN/MLF = Quad flat No-leads package. Also called as Micro Lead Frame.

 

QFP = Quad Flat Package.

 

MQFP = Metric Quad Flat Package.

 

TO-220 = Through-hole plastic package with three leads attached with a metal heat sink tab with hole on top.

 

SOT-23 / SOT-223 = Small Outline Transistor Package is SMT IC, having three pin-outs.